Director, Semiconductor IC Packaging & Assembly Engineering

Renesas Electronics

This role requires strong expertise in semiconductor packaging processes, including wirebond, flip chip, and advanced technologies.

Last checked on July 3, 2026. We may earn a commission when you click through.

This role offers a unique opportunity for seasoned professionals to lead in semiconductor packaging. However, it may not suit entry-level candidates seeking simpler roles.

✓ Strong focus on advanced packaging technologies ✓ Leadership opportunity in a reputable company ✓ Involvement in innovative semiconductor solutions

Director, Semiconductor IC Packaging & Assembly Engineering

Renesas Electronics

Updated 4 days ago

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Shah Alam

This role offers a unique opportunity for seasoned professionals to lead in semiconductor packaging. However, it may not suit entry-level candidates seeking simpler roles.

About this role

This role requires strong expertise in semiconductor packaging processes, including wirebond, flip chip, and advanced technologies.

About the Company

Renesas Electronics is a global leader in semiconductor solutions, specializing in microcontrollers, analog devices, and power management.

Key Highlights

✓ Expertise in wirebond and flip chip packaging processes
✓ Experience with advanced packaging technologies
✓ Involvement in power packaging and Smart Power Stages
✓ Leadership role in engineering and assembly
✓ Opportunity to work with cutting-edge semiconductor tech

💡 Honest Take: This position is ideal for those with significant experience in semiconductor packaging technologies, but may be challenging for less experienced candidates.

Pros

✓ Strong focus on advanced packaging technologies
✓ Leadership opportunity in a reputable company
✓ Involvement in innovative semiconductor solutions
✓ Located in a tech hub in Shah Alam

Cons

✗ Requires extensive experience in semiconductor processes
✗ Not suitable for entry-level candidates
✗ Potentially high-pressure environment

Best For: This role is tailored for professionals with a strong background in semiconductor technologies and leadership experience.

Watch Out: Be prepared for a fast-paced environment that demands high expertise in specific packaging technologies.

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What Customers Say

Employees appreciate the innovative environment and opportunities for professional growth, but some note the high-pressure expectations.

Expert Review

The Director position at Renesas Electronics is a compelling opportunity for those deeply versed in semiconductor packaging. With a focus on advanced techniques like wirebond and flip chip, this role demands technical skills but also leadership capabilities.

Expect to engage with technologies, including Smart Power Stages and power packaging. This is an excellent chance to influence engineering processes at a leading firm. However, the role is not for the faint-hearted; it requires significant prior experience.

Candidates should be aware of the pressure that comes with leadership roles in such a competitive sector. The job is located in Shah Alam, Malaysia, a strategic tech hub, which facilitates collaboration with various industry leaders. If you're ready for this challenge, more details can be found on Renesas's official page.